On August 7, Sharp held “SHARP Tech-Forum” at the Tokyo International Forum on the theme of semiconductors, which have recently been the focus of great interest in the industrial world. This event took place as a preliminary event to the “SHARP Tech Day” (to be held on November 11 this year) celebrating the 111th anniversary of the company.

　

■ Contents of “SHARP Tech-Forum”

Semiconductors are a fundamental technology that supports social innovations such as next generation communication technology, AI applications, and the advancement of robotics, etc. Strategic efforts are being made in many countries, and companies and research institutes around the world are actively engaged in research and development. In Japan, the importance of domestic production is increasing due to trade friction between the U.S. and China and from the perspective of economic security, and the government is supporting the return of semiconductor technology to the domestic market.

In order to present the latest industry trends and future prospects of semiconductors, this forum invited three experts from Japan and abroad who are active on the front lines of industry-academia-government; Dr. Shang-Yi Chiang, Hon Hai Technology Group semiconductor strategy officer, Professor Emerius Katsuaki Suganuma, Osaka University, and Mr. Hisashi Kanazashi, Director, IT Industry Division, Commerce and Information Policy Bureau, Ministry of Economy, Trade and Industry of Japan, to deliver lectures in the first half of the forum. The second half consisted of a panel discussion with these guests together with our company members.

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＜Section 1＞

Dr. Shang-Yi Chiang, Hon Hai Technology Group semiconductor strategy officer
Theme : “From Integrated Circuits to Integrated Chiplets”

Dr. Shang-Yi Chiang explained that while semiconductor integrated circuits are on the brink of a major transformation as an industry as Moore’s Law faces its physical limits, while in the near future, AIoT is likely to create a wide variety of products and increase interconnectivity of chiplets*¹. He then introduced the transformation of IC technology to adapt to this changing environment.

*1 A technology that connects multiple semiconductor integrated circuits, which were previously integrated on a single chip, like a block on a single substrate.

　

Professor Emeritus Katsuaki Suganuma, Osaka University (Director of F3D Collaborative Research Institute, The Institute of Scientific and Industrial Research, Osaka University)
Theme : “Collaboration to open up the next-generation semiconductor packaging technology”

Next, Professor Emeritus Katsuaki Suganuma introduced the progress of open innovation in next generation semiconductor packaging technology through the evolution of individual technologies and collaboration, and the future vision of new core technologies that will be created as a result.

Mr. Hisashi Kanazashi, Director, IT Industry Division, Commerce and Information Policy Bureau, Ministry of Economy, Trade and Industry of Japan
Theme : “Prospects for Semiconductor Industry Strategies to Win in the Global Era”

Mr. Hisashi Kanazashi explained that fierce global competition continues in the semiconductor industry, which is at the core of DX technology in society. He also introduced the future policy outlook.

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＜Section 2＞

Panel Discussion
Theme : “User demands in the AI era and direction of LSI technology“

After a short break, a panel discussion was held with Dr. Shang-Yi Chiang, Professor Emeritus Katsuaki Suganuma, and Mr. Hisashi Kanazashi together with Sharp members (Mototaka Taneya, Managing Officer, Head of Corporate Research and Development Group of Sharp, Norio Ito, Deputy General Manager of Society Innovation Laboratory and General Manager of Laboratory 4, Corporate Research and Development Group of Sharp, Naoki Makita, General Manager of Process Development Laboratory, Panel-Semicon Laboratories, and Toyofumi Horikawa, Director of Development Department No.2, Sharp Semiconductor Innovation Corporation).

At the beginning of the presentation, the Panel-Semicon Laboratories was introduced, which was newly established on July 1 to provide new products and services by integrating newly developed devices, such as cutting-edge displays and sensors, with semiconductor technology.

During the panel discussion, the panelists discussed the potential application of chiplet technology to the next-generation communication SoC*^２ , standardization of interfaces, and the creation of a new Japanese LSI industry in collaboration with the United States.

*2 SoC (System on a Chip): A design method in which many or all of the functions required for system operation are implemented on a single semiconductor chip. It also refers to a chip made using this method.

The panel discussion was followed by a Q&A session.

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The forum concluded with an introduction of the “SHARP Tech Day” to be hold on November 11 this year.

The event was very successful, with more than 600 people in attendance, including online viewing.

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Under the slogan of “Be a Game Changer,” Sharp is currently strengthening its own development resources and accelerating open innovation through collaboration with global companies and startups to create innovative technologies that will change the world, focusing on AI, robotics, XR, 6G, food, water, air, green and space.

At  “SHARP Tech Day” scheduled for November 11, we plan to introduce our future technology strategy and exhibit innovative products and solutions that employ our proprietary technologies, so please look forward to  “SHARP Tech Day”.

(Public Relations H) 

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■Press Releases :
Sharp to Hold Tech-Forum Inviting Experts　on the Theme of Semiconductors on August 7
Sharp Announces to Hold Sharp Technology Day on November 11, 2023 in Commemoration of its 111th Anniversary

■SHARP Blog :
Sharp commemorates its 111th anniversary – “Sharp Technology Day” will be held on November 11, 2023